Helping Customers Solve Problems to Yield a Competitive Advantage

Our products heat the core competencies in pressure measurement and control, flow geasurement and control, gas and vapor delivery and analysis in high-vacuum laser photonics manufacturing solutions.

Thermal Circuits’ heaters facilitate instruments, sub-systems and process control devices that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes and to improve process performance and productivity for our customers.

Cutting edge science and engineering are the building blocks. Thermal Circuits helps our customers succeed by being an empathetic listener and collaborative partner to solve the hardest technology challenges, together.

800ºC HTB In-Line Semiconductor and Wafer Processing 

Quartz Etchant Tank Heater

Preformed on quartz tube using high temperature binder (HTB).

Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry

HTB is Thermal Circuits’ proprietary High Tempurature Binder. This organic and inorganic coating is impregnated into materials such as fiberglass and quartz cloth, fiberglass matt and mica to facilitate compatibility of the etched foil element in applications up tto 1500ºF. The HTB’s coatings protect and provide macroscopic immobilization of the heating element and microscopic thermal expansion and contraction at watt densities many times greater than competitive products. The use of quartz in the etched foil heater allows for . direct mount without insulation and is preferred by designers forf high-wattage and high-temperature applications.

Wafer Processing

Although application similarities exist in the etched foil heating technology employed in Chuck Technology Integrated Circuitry, there are enough variables in wattage, temperature, and mounting methods to require designers to pay special attention to combining alternative insulations and films in order to insure the success of the end product. For example, this heater/heat sink assembly consists of an etched foil element encapsulated in a combination laminate of two thin film insulators: one Kapton® polyimide, the other Teflon®. The heater mounts to an anodized heat sink and a sensor is located in the center pedestal. Multi-heater/heat sink assemblies incorporate into multi-port boards designed to rapidly load/unload for “burning in” of silicone discs used in the computer industry.

Silicon Wafer Chuck Heater

Conductive Heater Assembly with Teflon® Insulation

Bonded to machined metal, with pressure sensitive adhesive PSA, RTD temperature sensor, thermal fuse, and wire harness with electrical connector.

220º High Temperature, Conductive Heater Assembly with Kapton® Polyimide Insulation

Heater for Electronic Enclosure Valve Heaters

Conductive heater assembly with Kapton® Polyimide dielectric insulation. Bonded to machined metalwork with thermistor, wire harness and connector.